Accurate
thermal modeling and the design of microelectronic devices and thin-film structures at the micro- and nanoscales poses a challenge to
electrical engineers who are less familiar with the basic concepts and
ideas in sub-continuum heat transport. This book aims to bridge that
gap. Efficient heat-removal methods are necessary to increase device
performance and device reliability. The authors provide readers with a
combination of nanoscale experimental techniques and accurate modeling
methods that must be employed in order to determine a device’s
temperature profile.
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